Alloys

KHP®7025 (CuNi3SiMg)

Standard designation

EN not standardised / UNS C70250

Chemical composition
Cu Rest
Ni [%] 3
Si [%] 0.65
Mg [%] 0.15
Description / applications

Applications: KHP®7025 is a CuNiSi material. KHP®7025 offers high electrical conductivity combined with high strength and good stress relaxation resistance. Applications: connectors, contact blades, contact springs, switches, relays, lead frames

Physical properties¹
Density 8.8 g/cm³
Electrical conductivity 23 - 29 m/Ω·mm²
40 - 50% IACS²
Thermal conductivity 190 W/m·K
Thermal expansion coefficient 17·10-6/K
E modulus 130 GPa³
¹Approximate values in soft state, measured at ambient temperature
²IACS = International Annealed Copper Standard
³1 GPa = 1 kN/mm²
Processing information
Weldability good
Solderability good
Stress crack corrosion none
Mechanical properties
Condition Tensile strength Rm [MPa] Yield strength Rp0.2 [MPa] Elongation
A50 [%]		 Hardness
HV
R620 620-760 min. 500 min. 11 180-220
R650 650-780 min. 585 min. 10 200-240
R690 690-800 min. 655 min. 8 210-250
R760 760-860 min. 700 min. 7 220-260

More information

Datasheet
File type
KHP®7025 (CuNi3SiMg)
PDF (299.36 KB)