Alloys

KHP®109 (CuNi1Sn0.9)

Standard designation

EN not standardised / UNS C19025

Chemical composition
Cu Rest
Ni [%] 1
Sn [%] 0.9
P [%] 0.05
Description / applications

KHP®109 is a CuNiSn material. KHP®109 has high conductivity combined with good mechanical properties. Applications: connectors, contact springs, switches, relays, semiconductor carriers

Physical properties¹
Density 8.9 g/cm³
Electrical conductivity 23 m/Ω·mm²
40% IACS²
Thermal conductivity 161 W/m·K
Thermal expansion coefficient 17·10-6/K
E modulus 130 GPa³
¹Approximate values in soft state, measured at ambient temperature
²IACS = International Annealed Copper Standard
Processing information
Weldability good
Solderability good
Stress crack corrosion none
Mechanical properties
Condition Tensile strength Rm [MPa] Yield strength Rp0.2 [MPa] Elongation
A50 [%]		 Hardness
HV
R335 335-470 min. 315 min. 15 120-155
R440 440-520 min. 420 min. 9 135-170
R500 500-570 min. 480 min. 5 155-180
R540 540-610 min. 520 min. 4 160-195
R580 580-650 min. 560 - 175-210
R630 630-730 min. 610 - min. 190

More information

Datasheet
File type
KHP®109 (CuNi1Sn0.9)
PDF (298.21 KB)