Alloys

KHP®105 (CuNi1Sn0.5)

Standard designation

EN not standardised / UNS C19020

Chemical composition
Cu Rest
Ni [%] 1
Sn [%] 0.5
P [%] 0.05
Description / applications

KHP®105 is a copper-nickel-tin alloy. KHP®105 is characterised by high electrical conductivity and is good for cold forming. Applications: contact blades, relays, switches, central electrical systems, lead frames, semiconductor carriers

Physical properties¹
Density 8.9 g/cm³
Electrical conductivity 29 m/Ω·mm²
50% IACS²
Thermal conductivity 197 W/m·K
Thermal expansion coefficient 17·10-6/K
E modulus 130 GPa
¹Approximate values in soft state, measured at ambient temperature
²IACS = International Annealed Copper Standard
Processing information
Weldability good
Solderability good
Stress crack corrosion none
Mechanical properties
Condition Tensile strength Rm [MPa] Yield strength Rp0.2 [MPa] Elongation
A50 [%]		 Hardness
HV
R400 400-480 min. 380 min. 7 120-150
R450 450-510 min. 430 min. 5 130-155
R490 490-550 min. 470 min. 5 145-170
R530 min. 530 min. 510 min. 4 min. 155

More information:

Datasheet
File type
KHP®105 (CuNi1Sn0.5)
PDF (298.45 KB)