KHP®7026 is one of the group of CuNiSi materials. KHP®7026 offers high strength combined with high electrical conductivity. Applications: connectors, contact blades, contact springs, switches, relays, lead frames
Physical properties¹
Density
8.8 g/cm³
Electrical conductivity
23 m/Ω·mm² 40% IACS²'³
Thermal conductivity
161 W/m·K
Thermal expansion coefficient
17·10-6/K
E modulus
130 GPa
¹Approximate values in soft state, measured at ambient temperature ²IACS = International Annealed Copper Standard ³1 GPa = 1 kN/mm²