KHP®105 (CuNi1Sn0,5) / UNS C19020

Standard designation

EN not standardised / UNS C19020

Chemical composition
Cu	Rest
Ni [%]	1
Sn [%]	0.5
P [%]	0.05

Description / applications

KHP®105 is a copper-nickel-tin alloy. KHP®105 is characterised by high electrical conductivity and is good for cold forming. Applications: contact blades, relays, switches, central electrical systems, lead frames, semiconductor carriers

Physical properties¹
Density	8.9 g/cm³
Electrical conductivity	29 m/Ω·mm² 50% IACS²
Thermal conductivity	197 W/m·K
Thermal expansion coefficient	17·10-6/K
E modulus	130 GPa
¹Approximate values in soft state, measured at ambient temperature ²IACS = International Annealed Copper Standard

Processing information
Weldability	good
Solderability	good
Stress crack corrosion	none

Mechanical properties
Condition	Tensile strength Rm [MPa]	Yield strength Rp0.2 [MPa]	Elongation A50 [%]	Hardness HV
R400	400-480	min. 380	min. 7	120-150
R450	450-510	min. 430	min. 5	130-155
R490	490-550	min. 470	min. 5	145-170
R530	min. 530	min. 510	min. 4	min. 155

More information:

Datasheet

File type

KHP®105 (CuNi1Sn0.5)

PDF (298.45 KB)